Conduction cooled leaded package printed circuit board
This is a model of a PCB conduction frame.
The blue area is on thickness and the green is a thicker area for high dissipation components. Holes in the frame allow the components to straddle the frame and be bonded to it.
The model was built very quickly by creating a uniform mesh in one operation then deleting elements where the frame is cut away.
Click to enlarge
This is a model of a PCB conduction frame.
The blue area is on thickness and the green is a thicker area for high dissipation components. Holes in the frame allow the components to straddle the frame and be bonded to it.
The model was built very quickly by creating a uniform mesh in one operation then deleting elements where the frame is cut away.
Click to enlarge
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