SSOP electronic component

This is a model of a SSOP component with a non-uniform heat load on the silicon die.  A 2D DXF file was imported, automeshed then extruded into the 3D geometry.  Even though the die is attached to a copper pad which is exposed on the underside of the package, this simulation fixes the lead tips are 0C.

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Model of the SSOP component.
Internal structure of the package showing the internal lead frame, the copper carrier, the die attach and the silicon die.
Shown are case temperatures for the defined condition.
Shown are temperatures of the internal structure. You can see the resultant non-uniform die temperatures.
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